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Typical Electrical and ThermalCharacteristics (continued)
20
3.5
V DS = -15V
T J = -55°C
3
1a
16
12
8
25°C
125°C
2.5
2
1.5
1b
T A = 2 5 C
4
1
1c
4.5"x5" FR-4 Board
o
Still Air
2oz COPPER MOUNTING PAD AREA (in )
0
0
-5
-10
I D , DRAIN CURRENT (A)
-15
-20
0.5
0
0.2 0.4 0.6 0.8
2
1
Figure 13. Transconductance Variation with Drain
Current and Temperature.
7
Figure 14. SOT-223 Maximum Steady-State Power
Dissipation versus Copper Mounting Pad
Area.
30
ms
0m
6
5
1a
10
3
1
RD
S(O
N)
LIM
IT
10
10
10
1m
s
0u
s
s
1s
4
1c
1b
0.3
V GS = -10V
10
DC
s
0.1
SINGLE PULSE
T A = 2 5 C
θ J A
3
4.5"x5" FR-4 Board
o
Still Air
0.03
R
= See Note 1c
T A = 25°C
2
0
0.2
0.4
0.6
V G S = - 1 0 V
0.8
1
0.01
0.1
0.2
0.5
1
2
5
10
30
50
2oz COPPER MOUNTING PAD AREA (in 2 )
Figure 15. Maximum Steady-State Drain
Current versus Copper Mounting Pad
Area.
1
- V DS , DRAIN-SOURCE VOLTAGE (V)
Figure 16. Maximum Safe Operating Area.
0.5
D = 0.5
R JA (t) = r(t) * R JA
θ
0.2
0.1
0.05
0.02
0.2
0.1
0.05
0.02
P(pk)
θ θ
R JA = See Note 1 c
0.01
0.01
t 1
t 2
T J - T A = P * R
θ JA
0.005
0.002
0.001
Single Pulse
(t)
Duty Cycle, D = t 1 / t 2
0.0001
0.001
0.01
0.1
1
10
100
300
t 1 , TIME (sec)
Figure 15. Transient Thermal Response Curve .
Note:
Thermal characterization performed using the conditions described in note 1c. Transient thermal response will change
depending on the circuit board design.
NDT454P Rev. D2
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